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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 14 tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com serial-in / parallel-out driver series 2-input i 2 c-b us serial in/parallel out drivers bu2098f description bu2098f is an open drain output driver.it incorporates a built -in shift register and a latch circuit to control a maximum of 8 outputs by a 2-line interface, linked to a microcontroller. an open drain output provides maximum 25ma current. features ? led can be driven directly ? 8 bit parallel output ? this product can be operated on low voltage ? compatible with i 2 c-b us *i 2 c-bus is a trademark of nxp semiconductors. applications ? drive of led ? drive of solenoid ? drive of relay pin configurations (top view) key specifications ? power supply voltage range: 2.7v to 5.5v ? output voltage: 0v to 15v ? operating temperature range: - 40 to +85 package w(typ) x d(typ) x h(max) sop16 10.00mm x 6.20mm x 1.71mm block diagrams power-on reset i 2 c-b us controller shift register sda scl a0 a1 a2 8bit latch write buffer q0 q7 15 14 13 12 11 10 9 8 7 6 5 4 3 2 q4 q5 q6 q7 n.c. sda v ss q3 q2 q1 q0 a2 a1 scl 1 v dd 16 a0 datashee t downloaded from: http:///
. 2/ 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com pin descriptions pin no. pin name i/o function 1 a0 i address input (internally pull- up ) 2 a1 i 3 a2 i 4 q0 o open drain output 5 q1 6 q2 7 q3 8 v ss - ground 9 q4 o open drain output 10 q5 11 q6 12 q7 13 n.c. - non connected 14 scl i serial clock input 15 sda i/o serial data input/output 16 v dd - power supply absolute maximum ratings parameter sym bol limits unit power supply voltage v dd -0.5 to +7.0 v input voltage v in -0.5 to v dd +0.5 v output voltage v o v ss to +18.0 v operating temperature t opr -40 to +85 c storage temperature t stg -55 to +125 c power dissipation p d 0.30 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 3.0m w per 1 c above 25 c . caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (t a =25 , v ss =0v) parameter symbol limits u nit power supply voltage v dd +2.7 to +5.5 v output voltage v o 0 to +15 v downloaded from: http:///
. 3/ 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com electrical characteristics (unless otherwise noted, v dd =5v, v ss =0v, t a =25 ) parameter symbol limits unit condition min typ max input high-level voltage v ih 0.7v dd - - v input low-level voltage v il - - 0.3v dd v output low-level voltage v ol - - 0.4 v i out =10ma input low-level current i il - - 2.0 a v in =0 input high-level current i ih - - -2.0 a v in =v dd output leakage current i oz - - 5.0 a output=high impedance v ou t =v dd static dissipation current i dd - - 2.0 a timing characteristics (unless otherwise noted, v dd =5v, v ss =0v, t a =25 ) parameter symbol fast mode i 2 c-b us standard mode i 2 c-b us unit min max min max scl clock frequency f scl 0 400 0 100 khz bus free time between start-stop condition t bus 1.3 - 4.7 - s hold time start condition t hd:sta 0.6 - 4.0 - s low period of the scl clock t low 1.3 - 4.7 - s high period of the scl clock t high 0.6 - 4.0 - s set up time re-start condition t su:sta 0.6 - 4 .7 - s data hold time t hd:dat 0 - 0 - s data set up time t su:dat 100 - 250 - ns rise time of sda and scl t r 20+0.1c b 300 - 1000 ns fall time of sda and scl t f 20+0.1c b 300 - 300 ns set up time stop condition t su:sto 0.6 - 4.0 - s capacitive load for sda line and scl line c b - 400 - 400 pf waveform of timing characteristics figure 1. timing chart (sda, scl) t bus sd a p t su:sto t hd:sta s t su:sta t su:dat t f t low t hd:dat t r s p t hd:sta scl t high s:start condition p:stop condition 90% 90% 1 0% 1 0% downloaded from: http:///
. 4/ 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com test circuits figure 2. test circuit of input h/lvoltage +1 5v r l =10k v dd v ss patterngenerator v ih v il v ss r l r l r l r l r l r l r l r l figure 3. test circuit of output l voltage 1 8 sw v dd v ss patterngenerator i out v ol v ss v ss figure 4. test circuit of input h/lcurrent v dd v ss i ih a v in + i il downloaded from: http:///
. 5/ 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com test circuit - continued figure 6. test circuit of timing characteristics figure 5. test circuit of output leak current / static dissipation curre nt 1 8 sw v dd v ss patterngenerator v dd a + i oz a + i dd +1 5v r l =10k v dd v ss patterngenerator v ss v dd r l r l r l r l r l r l r l r l downloaded from: http:///
. 6/ 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com power dissipation power dissipation(total loss) indicates the power that can be consu med by ic at t a =25c(normal temperature). ic is heated when it consumed power, and the temperature of ic chip beco mes higher than ambient temperature. the temperature that can be accepted by ic chip depends on circuit configura tion, manufacturing process, and consumable power is limi ted. power dissipation is determined by the temperature allowed in ic chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). the max imum junction temperature is typically equal to the maxim um value in the storage temperature range. heat generated by con sumed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this hea t dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja (c /w ).the temperature of ic inside the package can be estimated by this thermal resistance. figure 11 shows the model of therma l resistance of the package. thermal resistance ja , ambient temperature t a , maximum junction temperature t jmax , and power dissipation p d can be calculated by the equation below: ja = (t jmax - t a ) / p d (c /w ) derating curve in figure 12 indicates power that can be consum ed by ic with reference to ambient temperature. power that can be consumed by ic with reference to ambient temperature . power that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined by thermal resistance ja . thermal resistance ja depends on chip size, power consumption, package, ambient temperatu re, package condition, wind velocity, etc even when the s ame of package is used. thermal reduction curve indicates a reference v alue measured at a specified condition. 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 25 50 75 100 125 150 175 ambient temperature ta [c] power dissipation [ w] bu2098f 85 figure 8. derating curve figure 7. thermal resistance ?? ta [ ] ? ? tj [ ] M p [w] ambient temperature t a ( ) chip surface temperature t j ( ) power dissipation p d (w) ja =( t jmax - t a )/ p d (c /w ) downloaded from: http:///
. 7/ 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com function 1. serial interfacce 1.1 start condition the start condition is a high to low transition of the sda line while scl is high . 1.2 stop condition the stop condition is a l ow to high transition of the sda line while scl is high . figure 9. start / stop condition 1.3 acknowledge the master (p) puts a resistive high level on the sda line during the acknowledge clock pu lse. the peripheral (audio processor) that acknowledge has to pull-down ( lo w ) the sda line during the acknowledge clock pulse, so that the sda line is stable low during this clock pulse. the slave which has been addressed has to generate an acknowledgement after the reception of each byte, otherwis e the sda line remains at the high level during the ninth clock pulse time. in this case th e master transmitter can generate the stop information in order to abort the transfer. figure 10. acknowledge start condition sda scl s p stop condition confirm 9 8 1 scl (from master) sda (from master) sda (from slave) s not confirm ack signal clock for acknowledge downloaded from: http:///
. 8/ 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com function C continued 1.4 write data send the stave address from master following the start condi tion (s). this address consists of 7 bits. the left 1 bit (the foot bit) is fixed 0 . the stop condition (p) is needed to finish the data tran sferred. but the re-send starting condition (sr) enables to transfer the data without stop (p). figure 11. data transmit 1.5 data format the format is following. figure 12. data format table 1 . for write format slave address a0 to a2 each bit can be defined by the input levels of pins a0 to a3. a3 to a6 these 4 bits are fixed. r/w 0 write data d0 to d7 write 1 to d0 makes q0 pin high-impedance. and write 0 makes q0 pin low. d[1:7] and q[1:7] are same as d0 and q0. table 2. for (a2, a1, a0) to slave address a6 a5 a4 a3 a2 a1 a0 slave address 0 1 1 1 0 0 0 38h 0 1 1 1 0 0 1 39h 0 1 1 1 0 1 0 3ah 0 1 1 1 0 1 1 3bh 0 1 1 1 1 0 0 3ch 0 1 1 1 1 0 1 3dh 0 1 1 1 1 1 0 3eh 0 1 1 1 1 1 1 3fh s slave address r/w ack data ack p s slave address r/w ack data ack sr slave address r/w ack data ack p s a6 a5 a4 a3 a2 a1 a0 r/w ack d6 d5 d4 d3 d2 d1 d0 d7 ack p slave address write data fixed for bu2098f defined by external pin a0 a2 0 (write) 0 (write) 0 (write) downloaded from: http:///
datasheet datasheet . 9/14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 www.rohm.com function C continued 2. function of power supply is turning on 2.1 reset condition after power on reset, open drain outputs of q0 to q7 pins are on condition. then, the outputs becomes low voltage wh en pull-up resistor is connected . 2.2 rising time of power supply v dd must rise within 10ms. (t start ) if the rise time would exceed 10ms, it is afraid not to reset . figure 13. rising time of power supply timing chart figure 14. timing chart scl sda v dd 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 start condition stop condition a6 a5 a4 a3 a2 a1 a0 rw ack d7 d6 d5 d4 d3 d2 d1 d0 ack device code slave address external terminal diagram shows a status where a pull-up re sistor is connected to open drain output. 90% 10% t start 10ms q7 q6 q5 q4 q3 q2 q1 q0 downloaded from: http:///
. 10 / 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com i/o equivalence circuits a0 to a2 q0 to q7 sda scl vss vss vss vss vss vss vss v dd v dd v dd v dd q0 to q7 a0 to a2 sda vss vss v dd scl downloaded from: http:///
. 11 / 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take pr ec autions against reverse polarity when connecting the power supply, such as mounting an external diod e between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitan ce value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tr aces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. also ensure that the gro und traces of external components do not cause variations on the ground voltage. the ground lines must be as short a nd thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceedi ng this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inr ush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and de lays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling cap acitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capac itor directly to a low-impedance output pin may subject the ic to stress. always discharge cap acitors completely after each process or step. the ics pow er supply should always be turned off completely before connecting or remo ving it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during a ssembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during a ssembly to name a few. 11. unused input pins input pin s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small cha rge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifi ed, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
. 12 / 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com operational notes - continued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably f ormed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interferen ce among circuits, operational faults, or physical dama ge. therefore, conditions which cause these parasitic element s to operate, such as applying a voltage to an input pin l ower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power sup ply voltage is applied, make sure that the input pins ha ve voltages within the values specified in the electrical characte ristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. ordering information b u 2 0 9 8 f - e 2 part number package f: sop16 packaging and forming specification e2: embossed tape and reel marking diagrams sop16(top view) b u 2 0 9 8 f lot number 1pin mark downloaded from: http:///
. 13 / 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 tsz22111 ? 15 ? 001 ww w.rohm.com physical dimension, tape and reel information package name so p16 (unit : mm) pkg : sop16 drawing no. : ex114-5001 (max 10.35 (include.burr)) downloaded from: http:///
14 / 14 bu2098f tsz02201-0rhr1gz00100-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 11 .oct.2013 001 new release 01.sep.2015 002 page.9 function 2.1 reset condition open drain outputs after reset hi -z condition on condition page.9 timing chart open drain outputs after v dd is on outputs condition all high all low downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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